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Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture
1992
IEEE Transactions on Components, Hybrids and Manufacturing Technology
Absh.act-In this paper, a study of the variation of the piezoresistive coefficients from several rosettes on the same die, the same wafer, and finally at different doping levels across a number of wafers has been presented. A thorough error analysis of the method of applying a known uniaxial state of stress using a four-point bending (4PB) fixture was completed. A sensor error analysis demonstrated that it is very difficult to determine accurate values for the sum (rI1 TU) using the common
doi:10.1109/33.180057
fatcat:io35enjrwbf4tf7j6q7hbidm6q