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The utilization of solution‐processable organic semiconducting (OSC) polymers and the development of industrial‐relevant printing techniques enable cost‐efficient fabrication of optoelectronic devices for the mass market. Yet, the adaptation of viscoelastic properties of a functional ink to the respective printing technology is challenging. One crucial parameter is the formulation of the ink, which can be adjusted by selecting the combination of solvents that are mixed with the OSC. The currentdoi:10.5445/ir/1000122745 fatcat:hsujsxxjovahlokigdqznsku6u