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Proactive temperature management in MPSoCs
2008
Proceeding of the thirteenth international symposium on Low power electronics and design - ISLPED '08
Preventing thermal hot spots and large temperature variations on the die is critical for addressing the challenges in system reliability, performance, cooling cost and leakage power. Reactive thermal management methods, which take action after temperature reaches a given threshold, maintain the temperature below a critical level at the cost of performance, and do not address the temperature variations. In this work, we propose a proactive thermal management approach, which estimates the future
doi:10.1145/1393921.1393966
dblp:conf/islped/CoskunRG08
fatcat:6j4kgli3kfatrogb6h4yvybmmy