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Compact electronic devices are created primarily using fine patterning technology. Electroless Ni-P/Au plating plays an important role in the metal finishing for these printed circuit boards. In this study, we evaluated new additives containing high-valent metal ions for electroless nickel plating to improve pattern forming. Conventional additives have caused step plating or poor corrosion resistance. But the addition of high-valent metal ions could prevent these problems. Also, our researchdoi:10.5104/jiep.21.155 fatcat:op3oarhuorhe3g44kjz3haucyy