High speed interconnects on a PCB can alter the performance of the device when the data rate is in the order of Gbps range. These interconnects are necessary parts on a PCB since direct measurement of frequency characteristics of a device under test (DUT) at microwave frequencies is often difficult due to some intervening fixture used for feeding theDUT.These test fixtures or interconnect need to be characterized first andthen de-embedded. This paper focuses on measurement techniques used to

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... racterize high speed devices and describesan algorithm used to de-embed a test fixture (interconnects on PCB) with the help of measured S-parameters. Effects of De-embedding operation on various time domain parameters i.e. Eye width, Peak to peak amplitude level, Rise time etc. are analyzed.