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Accurate in situ measurement of peak noise and delay change induced by interconnect coupling
2001
IEEE Journal of Solid-State Circuits
An accurate in situ noise and delay measurement technique that considers interconnect coupling effects is presented. This paper improves upon previous work by proposing 1) a novel accurate peak detector to measure on-chip crosstalk noise, and 2) in situ measurement structure to characterize the dynamic delay effect. A test chip was fabricated using 0.35m process and measured results demonstrate the effectiveness of the proposed technique. Noise peak measurements show 40-60 mV (1.8% average)
doi:10.1109/4.953489
fatcat:5symvgeasrdsvo6i6ivsunrprq