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Non-destructive observation of stacking faults of silicon-wafer by means of photoacoustic microscopy
1985
Analytical Sciences
Preserved Fulltext
The inspections of stacking faults of Si-wafer were carried out by means of a home-made photoacoustic microscopy (PAM). The stacking faults, which are not observed by an optical microscope, could be measured non-destructively and the depth of stacking faults beneath the surface could also be estimated by PAM.
doi:10.2116/analsci.1.107
fatcat:2chkoq7glrda3he3qhkkiswv7y