Various aspects of advanced Si technology are highlighted in this session. The session begins with a comprehensive review of the emerging field of x-ray lithography and the use of synchrotron generated soft x-rays. This is followed by a discussion of the architecture of advanced integrated circuits and the concept of restructureable very large scale integration (RVLSI). The aspects of wafer fabrication and interconnection technology, including lithography, defects, insulators, links and cut-points are discussed.