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Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low resistance heat transport from device-to-spreader and compliance between materials with dissimilar coefficients of thermal expansion (CTEs), but few application-ready configurations have been produceddoi:10.1115/ipack2011-52148 fatcat:4eqznwyucfbqzeoiu4m4o3jmty