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Temporary bonding/de-bonding (TBDB) technology in a FOWLP process is required to adapt to a low temperature process because of the potential for damage in handling the thin molded compound embedding dies. We have developed laser releasable TBDB materials for low temperature bonding processes that enable UV laser release with high throughput and low thermal/mechanical stress. The developed TBDB materials consist of two layers, an adhesive layer and a release layer. The appropriate wafer bondingdoi:10.5104/jiepeng.11.e18-004-1 fatcat:yjqy6qfnorfn5ouessbpweabk4