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CMOS technology platform for ubiquitous microsensors
2017
2017 International Semiconductor Conference (CAS)
In this paper we review a range of microsensors based on a common CMOS platform technology. The technology features a CMOS core which includes high temperature tungsten metallization and a post-CMOS deep reactive ion etching step of the substrate to release membranes, where the sensing elements are embedded. In one single process we were able to accommodate a variety of sensors such as gas, humidity, pressure, flow, temperature and infra-red detectors and emitters. The benefits of this platform
doi:10.1109/smicnd.2017.8101149
fatcat:vzozkk5urrexzgn3kiljayae6a