The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessors

J. Parry, H. Rosten, G.B. Kromann
1998 IEEE transactions on components, packaging, and manufacturing technology. Part A (Print)  
Thermal resistance networks or "compact" models of the PowerPC 603 and PowerPC 604 microprocessors in controlled-collapsed-chip-connection / ceramic-ball-grid-array (C4/CBGA) single-chip package are derived from "detailed" three-dimensional conduction models of the parts by both analytical and data fitting techniques.
doi:10.1109/95.679039 fatcat:2kkdohevcjhofppxtzcnjkv7oa