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An electron cyclotron resonance (ECR) plasma has been used in conjuction with a solid metal sputter target for Cu deposition over 200-mm diameters. The goal is to develop a deposition process suitable for filling submicron, high aspect ratio features used for ultralarge scale integration. The system uses a permanent magnet for creation of the magnetic field necessary for ECR and is significantly more compact than systems equipped with electromagnets. A custom launcher design allows remotedoi:10.2172/10178692 fatcat:zb5jvzjvvrevhnbhy3mdsvjwcu