Microstructural evolution of Si 3 N 4 ceramics and thermal/mechanical properties were investigated with respect to the initial ¡-to-¢ ratios of the starting powders. The fast growth of elongated ¢-grains was observed in the ¡ powder, while the growth of relatively equiaxed grains occurred in the ¢ powder. In the cases where ¡/¢ mixed raw powder was used, exaggerated bimodal microstructural evolution occurred as a result of the abnormal grain growth. These microstructural variations of the Si 3

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... 4 had a significant influence on the mechanical and thermal properties, such as strength, fracture toughness and thermal conductivity. The bimodal microstructure, which consisted of large elongated grains surrounded by fine matrix grains, resulted in both high flexural strength and high fracture toughness. Controlling the microstructural evolution, resulted in a high thermal conductivity of 86 W/mK, a high flexural strength of 912 MPa, and a high fracture toughness of 7.88 MPa.m 1/2 from ¡/¢ mixed raw powder. The achievement of both high thermal and mechanical properties of Si 3 N 4 ceramics was highly essential for thermal management applications.