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Effects of the conventional bath additives ͓chloride ions ͑Cl − ͒, poly͑ethylene glycol͒ ͑PEG͒, bis͑3-sulfopropyl͒disulfide ͑SPS͒, and Janus green B ͑JGB͔͒ used in the damascene process on the filling of submicrometer trenches with electrodeposited copper were investigated by electrochemical polarization measurement and cross-sectional microscopy. The combination of Cl − and PEG inhibited copper deposition in the areas of opening of the trenches, while SPS accelerated it at the bottom.doi:10.1149/1.1867672 fatcat:tzwjlamujnfi3iuxchze5gxlcy