Note: Anodic bonding with cooling of heat-sensitive areas

Peter C. K. Vesborg, Jakob L. Olsen, Toke R. Henriksen, Ib Chorkendorff, Ole Hansen
2010 Review of Scientific Instruments  
Anodic bonding of silicon to glass always involves heating the glass and device to high temperatures so that cations become mobile in the electric field. We present a simple way of bonding thin silicon samples to borosilicate glass by means of heating from the glass side while locally cooling heat-sensitive areas from the silicon side. Despite the high thermal conductivity of silicon, this method allows a strong anodic bond to form just millimeters away from areas essentially at room temperature.
doi:10.1063/1.3277117 pmid:20113142 fatcat:5qqm4cvtjfg7xb336fb64kuikm