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The Ni electrodeposition into the trench pattern
トレンチ内へのNiめっき膜の作製
2008
MES
トレンチ内へのNiめっき膜の作製
Electroforming technologies of Ni have been widely used in nanoimprint technologies and micro reactor system. In this study, superconformal filling of trenches with electrodeposited Ni were made by using Damascene process. We focused on the effect of chloride ions on the growth of Ni film and
doi:10.11486/mes.18.0_2a3-1
fatcat:splcvif3ezcqjlbozgxhwozohq