The Ni electrodeposition into the trench pattern

安宅 一泰, 岡本 尚樹, 齊藤 丈靖, 近藤 和夫
2008 MES  
Electroforming technologies of Ni have been widely used in nanoimprint technologies and micro reactor system. In this study, superconformal filling of trenches with electrodeposited Ni were made by using Damascene process. We focused on the effect of chloride ions on the growth of Ni film and
doi:10.11486/mes.18.0_2a3-1 fatcat:splcvif3ezcqjlbozgxhwozohq