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Fabrication of Integrated Vertical Mirror Surfaces and Transparent Window for Packaging MEMS Devices
Journal of microelectromechanical systems
A scheme for creating metal-coated vertical mirrors in silicon, along with an integrated transparent package lid for assembling, packaging, and testing microelectromechanical systems (MEMS) devices is presented. Deep reaction ion etching (DRIE) method described here reduces the loading effect and maintains a uniform etch rate resulting in highly vertical structures. A novel self-masking lithography and liftoff process was developed to ensure that the vertical mirrors undergo uniformdoi:10.1109/jmems.2006.886010 fatcat:4nnbcvv5vrbfziaxt72wpwnz2m