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Two-phase microjet impingement cooling is a potential solution for removing heat from high-power VLSI chips. Arrays of microjets promise to achieve more uniform chip temperatures and very high heat transfer coefficients. This paper presents the design and fabrication of single-jets and multijet arrays with circular orifice diameters ranging from 40 to 76 m, as well as integrated heater and temperature sensor test devices. The performance of the microjet heat sinks is studied using thedoi:10.1109/jmems.2004.835768 fatcat:djh7pqxyovewrjjld5rng4tosu