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To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous researches formulated the dummy fill problem as a standard Linear Program (LP). However, solving the huge linear program formed by real-life designs is very expensive and has become the hurdle in deploying the technology. Even though there exist efficient heuristics, their performance cannot be guaranteed. In this paper, wedoi:10.1145/1629911.1630052 dblp:conf/dac/FengZYTZ09 fatcat:xko7uaaqz5hfpk2pl7uhlt2pqq