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Copper electrodeposition onto zinc for the synthesis of kesterite Cu2ZnSnS4 from a Mo/Zn/Cu/Sn precursor stack
2019
Electrochemistry communications
A chloride-free solution based on ethylene glycol was shown to be suitable for the electrodeposition of copper onto zinc, allowing the fabrication of a Mo/Zn/Cu/Sn metallic precursor stack. The addition of diethanolamine (DEA) played an essential role in minimizing displacement reactions by shifting copper reduction towards a more negative potential. The electrochemical behavior of copper species with and without DEA was studied by cyclic voltammetry, and subsequently confirmed by displacement
doi:10.1016/j.elecom.2019.106580
fatcat:dafizjo3lveznimybwrkdqrvum