Bath Stability of Electroless NiB Plating Using DMAB as a Reducing Agent and Evaluation of Solder Wettability of Deposited Films
DMABを還元剤とした無電解NiBめっきの浴安定性とめっき膜のはんだ濡れ性評価

Katsuhiko TASHIRO, Ken OHTAKA, Seiji YAMAMOTO, Satoshi KAWASHIMA, Hideo HONMA
2002 Journal of The Japan Institute of Electronics Packaging  
doi:10.5104/jiep.5.591 fatcat:2v7ia6su6bgx7m7kr76yqhxuwm