The purpose of this work is to clarify the thermal fatigue life of IVH (Interstitial Via Hole) in PWB (Printed Wiring Board) which is a laminated structure of glass fiber layer and resin layer. The glass fiber layer itself is a composite material consisting of glass fiber and resin. In order to estimate the thermal deformation behavior of IVH, ACTE (Apparent Coefficient of Thermal Expansion) of the glass fiber layer and the resin layer of PWB was measured using the digital image correlation

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... nology. The measured ACTE values were used as reference in the FEMA (Finite Element Method Analysis) of PWB. Two FEMA models, a laminated structure model and a homogeneous model, were considered. In case of the laminated structure model, the maximum equivalent plastic strain range (Δε pmax ) was found at the resin layer sandwiched between two glass fiber layers. The position of the numerically obtained Δε pmax value was found to be in good agreement with the position of the crack in PWB that occurred due to the application of thermal cycles test. The result of this study infers that the thermal fatigue deformation of IVH occurs due to the deformation of resin layer of PWB.