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Drop Reliability Performance Assessment for PCB Assemblies of Chip Scale Packages (CSP)
2005 7th Electronic Packaging Technology Conference
Drop impact reliability assessment of solder joints on the chip scale packages is critical for use in miniature handheld products. Replacement of lead-based with leadfree solders requires the need of evaluating its compatibility with existing printed circuit board surface finishes. A 15x15mm fine-pitch BGA with solder ball compositions of 36Pb-62Sn-2Ag and Sn-4Ag-0.5Cu on surface finishes of organic solderability preservative, electroless nickel immersion gold and immersion tin were tested. The
doi:10.1109/eptc.2005.1614404
fatcat:3smokzeuivhuhoyftfc5mpw2oe