The Development of Copper Materials Suitable for Low-temperature Sintering in the Air

井田 清信, 友成 雅則, 渡辺 満, 磯部 薫
2015 MES  
Copper powders suitable for Low-temperature sintering were prepared by the chemical reduction in liquid-phase. The copper powders consisted of large particles with a diameter of ca.10μm and ultra fine particles with a diameter of less than 100nm. Using conductive paste with the copper powders, we applied copper conductive films by heating in the ambient atmosphere. The copper conductive film cured at 120 o C performed 2.9×10 -3 Ω・cm as its resistivity. Cross-sectional SEM images of the films
more » ... wed that dence films were composed of sintered ultra fine particles, which filled vacancies between large particles. These results suggested that our copper powder played a role in a new wiring material.
doi:10.11486/mes.25.0_159 fatcat:6nmbiusuybbmdkxnc35g27hxxq