A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2017; you can also visit the original URL.
The file type is application/pdf
.
Three-dimensional system-in-package using stacked silicon platform technology
2005
IEEE Transactions on Advanced Packaging
In this paper, a novel method of fabricating threedimensional (3-D) system-in-package (SiP) using a silicon carrier that can integrate known good dice with an integrated cooling solution is presented. The backbone of this stacked module is the fabrication of a silicon carrier with through-hole conductive interconnects. The design, process, and assembly to fabricate silicon through-hole interconnect using a wet silicon etching method is discussed in this paper. The process optimization to
doi:10.1109/tadvp.2005.852895
fatcat:zpuhjowxczgc5crrsznghddc4a