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Multi-chip modules are now required to achieve higher system speed and greater density than the traditional single chip packages mounted on printed circuit boards. Algorithms for placement of bare dies and and routing of their interconnections on MCM substrates are r eviewed in this paper. Comparisons are given to point out the strengths and weaknesses of each approach. This information can assist researchers in identifying those areas which need improvement and application designers indoi:10.1142/s0129156495000122 fatcat:7ol7t3odobfthjpafu53ixijtq