A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2017; you can also visit <a rel="external noopener" href="http://www.bu.edu/peaclab/files/2014/03/sabry_ISCAS11.pdf">the original URL</a>. The file type is <code>application/pdf</code>.
Thermal analysis and active cooling management for 3D MPSoCs
<span title="">2011</span>
<i title="IEEE">
<a target="_blank" rel="noopener" href="https://fatcat.wiki/container/kucxvipvevedfgtsl3pnvxorse" style="color: black;">2011 IEEE International Symposium of Circuits and Systems (ISCAS)</a>
</i>
Preserved Fulltext
3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MPSoCs) and allowing more functionality per unit area. However, vertical integration of layers exacerbates the reliability and thermal problems, and cooling is a limiting factor in multi-tier systems. Liquid cooling is a highly efficient solution to overcome the accelerated thermal problems in 3D architectures. However, liquid cooling brings new challenges in modeling and run-time management. This paper
<span class="external-identifiers">
<a target="_blank" rel="external noopener noreferrer" href="https://doi.org/10.1109/iscas.2011.5938046">doi:10.1109/iscas.2011.5938046</a>
<a target="_blank" rel="external noopener" href="https://dblp.org/rec/conf/iscas/SabryzAC11.html">dblp:conf/iscas/SabryzAC11</a>
<a target="_blank" rel="external noopener" href="https://fatcat.wiki/release/sqe2aadtlzgnbkpvonhlpgx5bm">fatcat:sqe2aadtlzgnbkpvonhlpgx5bm</a>
</span>
more »
... es a design-time/run-time thermal management policy for 3D MPSoCs with inter-tier liquid cooling. First, we perform a design-time analysis to estimate the thermal impact of liquid cooling and dynamic voltage frequency scaling (DVFS) on 3D MPSoCs. Based on this analysis, we define a set of management rules for run-time thermal management. We utilize these rules to control and adjust the liquid flow rate in order to match the cooling demand for preventing energy wastage of overcooling, while maintaining a stable thermal profile in the 3D MPSoCs. Experimental results on multi-tier 3D MPSoCs show that proposed design-time/run-time management policy prevents the system to exceed the given threshold temperature while reducing cooling energy by 50% on average and system-level energy by 18% on average in comparison to using a static worstcase flow rate setting.
<a target="_blank" rel="noopener" href="https://web.archive.org/web/20170809083236/http://www.bu.edu/peaclab/files/2014/03/sabry_ISCAS11.pdf" title="fulltext PDF download" data-goatcounter-click="serp-fulltext" data-goatcounter-title="serp-fulltext">
<button class="ui simple right pointing dropdown compact black labeled icon button serp-button">
<i class="icon ia-icon"></i>
Web Archive
[PDF]
<div class="menu fulltext-thumbnail">
<img src="https://blobs.fatcat.wiki/thumbnail/pdf/6c/44/6c44e18ead8b2da9e31ee6b8515fb9a8079546b4.180px.jpg" alt="fulltext thumbnail" loading="lazy">
</div>
</button>
</a>
<a target="_blank" rel="external noopener noreferrer" href="https://doi.org/10.1109/iscas.2011.5938046">
<button class="ui left aligned compact blue labeled icon button serp-button">
<i class="external alternate icon"></i>
ieee.com
</button>
</a>