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超薄型半導体デバイス用エポキシ樹脂の熱劣化挙動
Thermal Aging Behavior of Epoxy Resin Used in Ultra-thin Semiconductor Devices
2005
Seikei-Kakou
Thermal Aging Behavior of Epoxy Resin Used in Ultra-thin Semiconductor Devices
Preserved Fulltext
High temperature loads were applied under isothermal conditions to a film type epoxy resin, which is utilized in ultra-thin semiconductor packages. Dynamic viscoelastic properties, such as storage modulus, loss modulus and glass transition temperature, were measured after these accelerated thermal aging tests. An increase in the glass transition temperature upon thermal aging could be described by an Arrhenius process relating the aging temperature and a thermal aging rate coefficient.
doi:10.4325/seikeikakou.17.270
fatcat:6mnvnfixkbbzvakdsr4sweoihm