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500+ MHz designs using deep-submicron (DSM) copper interconnects require accurate and efficient modeling of cladding-metals' frequency-dependent impedance . In this paper, for the first time, we simulate and describe the current distribution inside a copper-based interconnect in a rich set of multi-line structures. The difference of the resistivities of copper alloy and the cladding metals causes a non-monotonic current density versus cross-wire axis relation. The same situation does notdoi:10.1145/332357.332386 dblp:conf/ispd/ChangCM00 fatcat:wb73tr5df5frjebifcmo7wvfnq