A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2017; you can also visit the original URL.
The file type is application/pdf
.
Simulating frequency-dependent current distribution for inductance modeling of on-chip copper interconnects
2000
Proceedings of the 2000 international symposium on Physical design - ISPD '00
500+ MHz designs using deep-submicron (DSM) copper interconnects require accurate and efficient modeling of cladding-metals' frequency-dependent impedance [1]. In this paper, for the first time, we simulate and describe the current distribution inside a copper-based interconnect in a rich set of multi-line structures. The difference of the resistivities of copper alloy and the cladding metals causes a non-monotonic current density versus cross-wire axis relation. The same situation does not
doi:10.1145/332357.332386
dblp:conf/ispd/ChangCM00
fatcat:wb73tr5df5frjebifcmo7wvfnq