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Integrating photovoltaic applications within urban environments creates the need for more compact and efficient power electronics that can guarantee long lifetimes. The upcoming wide-bandgap semiconductor devices show great promise in providing the first two properties, but their packaging requires further testing in order to optimize their reliability. This paper demonstrates one iteration of the design for reliability methodology used in order to compare the generated thermo-mechanical stressdoi:10.3390/en13225900 fatcat:7kra2otzujdlvcwnczonbpecvy