微量Snを含むAl‐2%Cu合金の析出過程について
Aging behavior of Al-2%Cu alloys containing a small amounts of Tin

Tsuneo TAKAHASHI, Yo KOJIMA, Yoshito OKI, Kazuhiro MIHAMA, Yoshinori ANDO
1976 Keikinzoku/Journal of Japan Institute of Light Metals  
The aging behaviors of Al-2%Cu binary and Al-2%Cu alloys containing 0.01, 0.02, and 0.03%Sn were investigated. Measurements of hardness and electric resistivity, X-ray diffraction and transmission electron microscopy were carried out. The clusters or aggregations of Cu atoms had been formed in the quenched state. The formation of clusters was suppressed with Sn addition. The clusters in the quenched state vanished partly during subsequent aging treatment. In the high resolution electron
more » ... on electron micrographs, the disc-like G.P. zones and 6"-phases were observed in the ternary alloys within short aging time in comparison with the binary alloys. The effect of Sn addition was shown as the growth of large precipitates with low density in comparison with the binary alloys.
doi:10.2464/jilm.26.587 fatcat:ov6vxwgspzgcvovi3lhgvhkdeu