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Numerical study on photoresist etching processes based on a cellular automata model
2007
Science in China Series E: Technological Sciences
For the three-dimensional (3-D) numerical study of photoresist etching processes, the 2-D dynamic cellular automata (CA) model has been successfully extended to a 3-D dynamic CA model. Only the boundary cells will be processed in the 3-D dynamic CA model and the structure of "if-else" description in the simulation program is avoided to speed up the simulation. The 3-D dynamic CA model has found to be stable, fast and accurate for the numerical study of photoresist etching processes. The
doi:10.1007/s11431-007-0005-5
fatcat:hgoltjqxjzdn3plfgmmbtsar4e