Novel power MOSFET packaging technology doubles power density in synchronous buck converters for next generation microprocessors

A. Sawle, C. Blake, D. Maric
APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335)  
This paper will introduce a novel power packaging technology developed by International Rectifier. This new packaging technology breaks ground in reducing package related losses and thus allowing designers to develop power supplies capable of meeting the demands of latest generation processors.
doi:10.1109/apec.2002.989234 fatcat:ynkble7bdraqhilmd5txmsdjea