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Using criteria of bandwidth and energy consumption for signal guiding and processing, system-level figures of merit for both passive and active plasmonic circuit components are introduced, benchmarking their performance for the realisation of high-bandwidth optical data communication on a chip. The figure of merit for passive plasmonic interconnects has been derived in terms of the system level performance of the plasmonic circuitry, emphasising the bandwidth and power consumption densities.doi:10.1109/jproc.2016.2603118 fatcat:pfdvogtv3vhvbkrbqu46ipwdei