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Bonding process of Al/Cu dissimilar bonding with Liquefaction in Air
液化をともなう大気中Al/Cu異材接合の接合過程
2007
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
液化をともなう大気中Al/Cu異材接合の接合過程
bonding in the air can be accomplished at the temperature range between eutectic temperature of Al-Cu system and melting point of Al. The change of microstructure in Al/Cu bond was investigated by SEM observation and EPMA analysis. The observed specimens were obtained by the difference of displacement of bonded specimen. Mushroom shape of L is observed in Al side at the first step of the initial stage of bonding process. The phase in Cu side begins to be observed significantly at the second
doi:10.2207/qjjws.25.51
fatcat:p5ia5ggygvek7pp6blx5y267my