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Evalution of Drop Strength due to Thermal Degradation for BGA-IC Package
熱劣化したBGA‐ICパッケージはんだ接合部の衝撃強度の評価
2006
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
熱劣化したBGA‐ICパッケージはんだ接合部の衝撃強度の評価
Preserved Fulltext
The effects of 125℃ holding time on static strength of package solder ball and impact strength
doi:10.1299/kikaia.72.186
fatcat:7zg5cf24pzdt3i5mm4r47ain54