Evalution of Drop Strength due to Thermal Degradation for BGA-IC Package
熱劣化したBGA‐ICパッケージはんだ接合部の衝撃強度の評価

YoungBae KIM, Hiroshi NOGUCHI, Masazumi AMAGAI
2006 TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A  
The effects of 125℃ holding time on static strength of package solder ball and impact strength
doi:10.1299/kikaia.72.186 fatcat:7zg5cf24pzdt3i5mm4r47ain54