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Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade

Katherine Dunne, Maurice Garcia-Sciveres, Timon Heim
2018 Proceedings of Topical Workshop on Electronics for Particle Physics — PoS(TWEPP-17)   unpublished

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A quad chip module hybrid assembled with FE-I4B chips has been fabricated to test performance in a serially powered module chain as would be used in the upgraded ATLAS pixel layer at the High Luminosity LHC. This poster present results of the development of a flex circuit board interface for the quad chip modules and system integration tests of modules installed on an Ibeam. Experience from these hybrid assemblies will inform the design of a flex hybrid for the new large format readout chip,
more » ... 3A, which will be produced in 2017 by the RD53 collaboration.
doi:10.22323/1.313.0065 fatcat:hcz2mczolndktoe6vs7vchbrdm
Citation

Katherine Dunne, Maurice Garcia-Sciveres, Timon Heim. "Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade." Proceedings of Topical Workshop on Electronics for Particle Physics — PoS(TWEPP-17) (2018)