Amplitude and phase defect inspection on EUV reticles using RESCAN

Iacopo Mochi, Sara Fernandez, Ricarda Nebling, Uldis Locans, Patrick Helfenstein, Rajendran Rajeev, Atoosa Dejkameh, Dimitrios Kazazis, Li-Ting Tseng, Yasin Ekinci, Nelson M. Felix, Kenneth A. Goldberg
2019 Extreme Ultraviolet (EUV) Lithography X  
Reliable photomask metrology is required to reduce the risk of yield loss in the semiconductor manufacturing process. Actinic pattern inspection (API) of EUV reticles is a challenging problem to tackle with a conventional approach. For this reason we developed an API platform based on coherent diffraction imaging. Aim: We want to verify the sensitivity of our platform to absorber and phase defects. Approach: We designed and manufactured two EUV mask samples with absorber and phase defects and
more » ... inspected them with RESCAN in die-to-database mode. Results: We reconstructed an image of an array of programmed absorber defects and we created a defect map of our sample. We inspected two programmed phase defect samples with buried structures of 3.5 nm and 7.8 nm height. Conclusions: We verified that RESCAN in its current configuration can detect absorber defects in random patterns and buried (phase) defects down to 50 × 50 nm 2 .
doi:10.1117/12.2515160 fatcat:igkcsofqazcd7i4yt6czevvwhq