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Amplitude and phase defect inspection on EUV reticles using RESCAN
2019
Extreme Ultraviolet (EUV) Lithography X
Reliable photomask metrology is required to reduce the risk of yield loss in the semiconductor manufacturing process. Actinic pattern inspection (API) of EUV reticles is a challenging problem to tackle with a conventional approach. For this reason we developed an API platform based on coherent diffraction imaging. Aim: We want to verify the sensitivity of our platform to absorber and phase defects. Approach: We designed and manufactured two EUV mask samples with absorber and phase defects and
doi:10.1117/12.2515160
fatcat:igkcsofqazcd7i4yt6czevvwhq