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Centip3De: A Cluster-Based NTC Architecture With 64 ARM Cortex-M3 Cores in 3D Stacked 130 nm CMOS
2013
IEEE Journal of Solid-State Circuits
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We present Centip3De, a large-scale 3D CMP with a cluster-based near-threshold computing (NTC) architecture. Centip3De uses a 3D stacking technology in conjunction with 130 nm CMOS. Measured results for a two-layer, 64-core system are discussed, with the system achieving 3930 DMIPS/W energy efficiency, which is > 3x improvement over traditional operation at full supply voltage. This project demonstrates the feasibility of large-scale 3D design, a synergy between 3D and NTC architectures, a
doi:10.1109/jssc.2012.2222814
fatcat:3wc3rliiajddnmk432u5223ldm