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Defect tolerant extreme ultraviolet lithography technique
2012
Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
Comparison of the effects of downstream H2-and O2-based plasmas on the removal of photoresist, silicon, and silicon nitride J. Vac. Sci. Technol. B 31, 021206 (2013) Impacts of point spread function accuracy on patterning prediction and proximity effect correction in low-voltage electron-beam-direct-write lithography J. Vac. Sci. Technol. B 31, 021605 (2013) Origin of defects on targets used to make extreme ultraviolet mask blanks J. Vac. Sci. Technol. A 31, 021403 (2013) Nanometer scale
doi:10.1116/1.4758758
fatcat:ftwgcn4hejcrtfuu22asonyloi