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Three-dimensional structures for photonic crystal applications have been fabricated up to now either by pure bottom-up approaches such as colloidal self-assembly, by pure top-down approaches using very large scale integration technology, or by interference lithography. Here we evaluate a concept enabling large photonic band gaps in simple cubic structures, the manufacturing of which is based on photoelectrochemical etching of strongly modulated macroporous silicon. A subsequent anisotropicdoi:10.1063/1.1993752 fatcat:npovjkcfkzdedhazmyp43oxn6a