A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2020; you can also visit the original URL.
The file type is application/pdf
.
Adaptive 3D-IC TSV Fault Tolerance Structure Generation
[article]
2018
arXiv
pre-print
In three dimensional integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in providing vertical connections. However, the yield and reliability is one of the key obstacles to adopt the TSV based 3D-ICs technology in industry. Various fault-tolerance structures using spare TSVs to repair faulty functional TSVs have been proposed in literature for yield and reliability enhancement, but a valid structure cannot always be found due to the lack of effective generation
arXiv:1803.02490v1
fatcat:w27phjdngfdwrcesirk7mxhvhy