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Analysis and optimization of thermal issues in high-performance VLSI
Proceedings of the 2001 international symposium on Physical design - ISPD '01
This paper provides an overview of various thermal issues in highperformance VLSI with especial attention to their implications for performance and reliability. More specifically, it examines the impact of thermal effects on both interconnect design and electromigration reliability and discusses their impact on the allowable current density limits. Furthermore, it also discusses how thermal and reliability constrained current density limits may conflict with those obtained through purelydoi:10.1145/369691.369779 dblp:conf/ispd/BanerjeePA01 fatcat:ltpnvmmpynczbdmccdnk34djqm