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Development of 2.1D Package Structure using Fine-Pitch Organic Interposer
2.1D 有機インターポーザの実装技術開発
2015
MES
2.1D 有機インターポーザの実装技術開発
Devices Corporation 2.1D packaging solution is expected to one of technologies to realize higher bandwidth while using less power at lower cost than 2.5D Packaging. We simulated electrical and thermal characteristics and indicated that the 2.1D structure package had sufficient characteristics as well as the 2.5D structure. And we estimated the bondability utilizing Non-Conductive Paste Flip-Chip Bonding technology and confirmed good reliability of 2.1D structure, which has the organic interposer with fine line and space.
doi:10.11486/mes.25.0_305
fatcat:ccao7vfhmjeu3fyywlashx3csy