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2009 IEEE 8th International Conference on ASIC
Lithography process has become one of the most fundamental limitations for 22nm technology node because of the following reasons: 1) combining immersion and computational lithography, which is the most advanced lithography scheme, may not be enough to be used for 22nm patterning, 2) EUV (Extreme Ultra-Violet) lithography may not be available for mass production in the near future. As a practical solution, pitch doubling technique known as double patterning lithography (DPL) has become a strongdoi:10.1109/asicon.2009.5351308 fatcat:5xs2ay5snvd4bng6pc6zb33f6y