A review of 3-D packaging technology

S.F. Al-Sarawi, D. Abbott, P.D. Franzon
1998 IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B  
This paper reviews the state-of-the-art in threedimensional (3-D) packaging technology for very large scale integration (VLSI). A number of bare dice and multichip module (MCM) stacking technologies are emerging to meet the ever increasing demands for low power consumption, low weight and compact portable systems. Vertical interconnect techniques are reviewed in details. Technical issues such as silicon efficiency, complexity, thermal management, interconnection density, speed, power etc. are
more » ... d, power etc. are critical in the choice of 3-D stacking technology, depending on the target application, are briefly discussed. Index Terms-Bare dice stacking, MCM stacking, 3-D MCM technology, 3-D packaging, vertical interconnection.
doi:10.1109/96.659500 fatcat:m5fljolagvgdjkbth2rexllvpe