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Thermal-aware lifetime reliability in multicore systems
2010
2010 11th International Symposium on Quality Electronic Design (ISQED)
As the power density of modern electronic circuits increases dramatically, systems are prone to overheating. High temperatures not only raise packaging costs, degrade system performance, and increase leakage power consumption, but also reduce the system reliability. Due to many limits in single core design including the performance and the power density, the microprocessor industry has switched their attentions to multicore design to enable the scaling of performance. Thermal effects on
doi:10.1109/isqed.2010.5450548
dblp:conf/isqed/WangC10
fatcat:c26s3qf5u5h2vnix4miuvz7up4