Implementation of Solder-bead Probing in High Volume Manufacturing

Madhavan Doraiswamy, James Grealish
2006 Test Conference (ITC), Proceedings, IEEE International  
Solder-bead probing is a test technology primarily targeting high-speed/high-density printed circuit boards. It is a promising complement to traditional probing solutions, because test access points are placed directly on board traces, thus addressing shrinking board real estate without compromising test quality. This paper summarizes the design, manufacturing, and test parameters Intel will use to implement the technology in a high volume manufacturing environment.
doi:10.1109/test.2006.297710 dblp:conf/itc/DoraiswamyG06 fatcat:7xphyigjxnevnf7x66srteampq