3D-HIM: A 3D High-density Interleaved Memory for bipolar RRAM design

Yi-Chung Chen, Hai Li, Wei Zhang, Robinson E. Pino
2011 2011 IEEE/ACM International Symposium on Nanoscale Architectures  
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doi:10.1109/nanoarch.2011.5941484 dblp:conf/nanoarch/ChenLZP11 fatcat:fqi6ya7sengirc75vt57yzeyvu